| 摘要 |
<p>To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. In the flux which is mixed with solder powder to produce the solder paste, an amount of phosphoric acid ester, which is adsorbed to a surface of a soldered portion during the soldering to form a film having hydrophobic quality is contained. It is preferable that an addition amount of phosphoric acid ester is not less than 1 mass% through less than 30 mass%. Further, it is preferable that the phosphoric acid ester is any one of (2-ethylhexyl) phosphate, monoisodecyl phosphate, monobutyl phosphate, dibutyl phosphate, monolauryl phosphate, monostearyl phosphate, monooleyl phosphate, tetracosyl phosphate or bis(2-ethylhexyl) phosphate.</p> |
