EMBEDDED TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are an embedded type printed circuit board and a manufacturing method thereof capable of remarkably shortening an electric connection path while minimizing the thickness of the printed circuit board and the volume of the components. The embedded type printed circuit board according to the present invention includes: a core layer which has an upper side and a lower side and has a chip insertion hole which penetrates the upper side and the lower side; an internal circuit pattern which is formed on the upper and lower sides of the core layer and the inner wall of the core layer; a first resin layer which covers the upper side of the core layer and has a first via hole which exposes a part of the inner circuit pattern; a second resin layer which covers the lower side of the core layer and has a second via hole which exposes a part of the inner circuit pattern; a first external circuit pattern which is formed on the upper part of the first resin layer and is electrically connected to the internal circuit pattern through the first via hole; a second external circuit pattern which is formed in the lower part of the second resin layer and is electrically connected to the internal circuit pattern through the second via hole; and a built-in chip which is inserted into the chip insertion hole of the core layer and one end and the other end respectively electrically connected to the first and second external circuit patterns.