发明名称
摘要 An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.
申请公布号 JP5384942(B2) 申请公布日期 2014.01.08
申请号 JP20080547565 申请日期 2006.12.21
申请人 发明人
分类号 H02G15/00;H01R4/20;H01R4/64;H01R4/70;H01R4/72 主分类号 H02G15/00
代理机构 代理人
主权项
地址