| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer with an adhesive which is useful for sufficiently simplifying the manufacturing process of a semiconductor chip, a method of manufacturing the same, and an adhesive composition used as an adhesive of the wafer. SOLUTION: A wafer 10A with an adhesive according to the present invention has a semiconductor wafer 1 and an adhesive 2 applied on a surface of the semiconductor wafer 1 by a printing process. The method of manufacturing the wafer 10A with the adhesive according to the present invention includes a first step of applying an adhesive composition on the surface of the semiconductor wafer 1 by the printing process, and a second step of volatilizing a solvent contained in the adhesive composition having been applied in the first step. COPYRIGHT: (C)2009,JPO&INPIT |
