POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTION TERMINAL

摘要

Provided are a positive-type photoresist composition for a thick film, a method for producing a thick film resist pattern using the same, and a method for producing a connection terminal. The positive-type photoresist composition used for forming the thick film resist pattern on a supporter includes a resin component (A) in which the solubility for a developer is changed by actions of the acid; and an acid generator component (B) which generates acid by light exposure. The acid generator component (B) includes an acid generator (B1) which includes a compound represented by general formula (b1-1). [In the formula, Y^1 is a bivalent coupler; W is S, Se or I; R1 is a hydrocarbon having a substituent; R2 is an alkyl group with 1-5 hydrocarbons or alkoxy groups; if W=I, m+n=2; if W=S or Se, m+n=3, and m>=1, n>=0; p is 0-5; and X^- is double anion].