发明名称 |
Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device |
摘要 |
The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions. |
申请公布号 |
US8624343(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201213564765 |
申请日期 |
2012.08.02 |
申请人 |
FUKE KAZUHIRO;ONISHI HIDENORI;OTA SHINYA;NITTO DENKO CORPORATION |
发明人 |
FUKE KAZUHIRO;ONISHI HIDENORI;OTA SHINYA |
分类号 |
H01L31/0203 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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