发明名称 |
Method for semiconductor leadframes in low volume and rapid turnaround |
摘要 |
An apparatus comprising a metallic leadframe including a pad and a plurality of leads. Each having a first and a parallel second surface and sidewalls normal to the surfaces. The pad and each lead having a core of a first metal and layers of a second metal different from the first metal on each surface. The first metal exposed at the sidewalls and at portions of the first surface of the pad. A semiconductor chip is assembled on the leadframe. Portions of the assembled chip and the leadframe are packaged in a polymeric encapsulation compound. |
申请公布号 |
US8624363(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201213364980 |
申请日期 |
2012.02.02 |
申请人 |
KODURI SREENIVASAN K.;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
KODURI SREENIVASAN K. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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