发明名称 |
Continuous vacuum deposition method |
摘要 |
A continuous vacuum sputtering method includes the steps of providing a substrate; providing a continuous vacuum sputtering machine comprising a depositing chamber. The depositing chamber comprising at least one vacuum chamber, each vacuum chamber having a cathodic arc emitting source located therein; the substrate being loaded in the continuous vacuum sputtering machine; depositing a coating on the substrate by cathodic arc deposition using the cathodic arc emitting source. |
申请公布号 |
US8623182(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201113097207 |
申请日期 |
2011.04.29 |
申请人 |
CHANG HSIN-PEI;CHEN WEN-RONG;CHIANG HUANN-WU;TAI LONE-WEN;CHEN CHENG-SHI;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
CHANG HSIN-PEI;CHEN WEN-RONG;CHIANG HUANN-WU;TAI LONE-WEN;CHEN CHENG-SHI |
分类号 |
C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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