发明名称 A RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD FOR MANUFACTURING THEREOF AND ARRAY PANEL COMPRISING THE SAME
摘要 <p>Disclosed herein is a resin composition for an organic insulating layer, a method of manufacturing the same, and a display panel including an insulating layer formed using the resin composition. The resin composition for an organic insulating layer is produced by polymerizing about 5 to about 35 wt % of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, about 5 to about 40 wt % of a styrene compound, about 5 to about 40 wt % of an epoxy compound, about 0.1 to about 10 wt % of an isobornyl compound, and about 20 to about 40 wt % of a dicyclopentadiene compound, based on the total weight of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, styrene compound, isobornyl compound, and dicyclopentadiene compound.</p>
申请公布号 KR101348757(B1) 申请公布日期 2014.01.07
申请号 KR20060010503 申请日期 2006.02.03
申请人 发明人
分类号 C08L25/08;C08L31/00;C08L63/00 主分类号 C08L25/08
代理机构 代理人
主权项
地址