| 摘要 |
A sealing apparatus of an organic light emitting diode of the present invention comprises: a chamber; a stage which is prepared in the chamber, has an organic light emitting layer in one side thereof, and on which a substrate to which at least one film is temporarily attached is mounted; a press plate prepared in an upper part of the stage; an elevating part which is prepared in a lower part of the stage, and elevates the stage such that the substrate and the film can be pressurized by the stage and the press plate; and a pressure buffer part which is prepared in the stage, and enables the substrate and the film to be in contact with each other from a center part during the pressurization. As a result, it is possible to easily remove bubbles according as the substrate and the film are pressurized and bonded from a center part to an outer part by the elevating part for pressurizing the substrate and the film, and produce high quality products by uniformly bonding entire surfaces of the substrate and film. |
