| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, having good flowability on molding and excellent in tight adhesion to semiconductor members, and a semiconductor device sealed with the composition. SOLUTION: The epoxy resin composition for sealing a semiconductor contains an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a silane coupling agent (D), wherein the silane coupling agent (D) contains a silane coupling agent (d) represented by formula (I).
|
