JUMPER CHIP PART

摘要

Provided is a jumper chip part that is unlikely to fracture even when the dimensions are increased. An insulating substrate (3) is composed of a glass-epoxy substrate. A front-surface conductive layer (5) and a back-surface conductive layer (7) are composed of copper foil secured to the front surface (3a) and the back surface (3b) of the insulating substrate (3). A pair of terminal electrodes (9, 11) are formed at the end of the insulating substrate (3), and are electrically connected to the front-surface conductive layer (5) and the back-surface conductive layer (7).