| 摘要 |
A fluid-cooled heat sink for electronic components includes a first metal plate designed to be positioned in contact with at least one electronic component and a second plate having a first face and a second face. The first face of the second plate is joined to the first plate. The first face of the second plate has a groove formed therein for accommodating a cooling liquid. The first face and the second face of the second plate are parallel at least along the length of the groove.
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