| 摘要 |
<p>A printed wiring board connection structure is configured by compressing and connecting a first printed wiring board (10) and a second printed wiring board (20), at least one of which is formed by a flexible printed wiring board, with a conductive adhesion layer (150) therebetween, and is provided with a first mark (14, 15) formed in the first printed wiring board (10), and a second mark (24, 25) formed in the second printed wiring board (20). The area of the outline of one mark out of the first mark (14, 15) and the second mark (24, 25) is larger than the area of the outline of the other mark, and when the printed wiring boards (10, 20) are in an permissible connection state, at least part of the region of the outline of the other mark is located within the region of the outline of the one mark when viewed from the direction in which both the printed wiring boards are stacked.</p> |
