SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC INSTRUMENT

摘要

This solid-state imaging element is provided with: a semiconductor substrate; a photoelectric conversion element provided to the semiconductor substrate; a photoelectric conversion film disposed on the light-receiving-surface-side of the semiconductor substrate; a contact part provided to the semiconductor substrate, a signal charge generated in the photoelectric conversion film being read by the contact part; a first film member covering the photoelectric conversion element from above; and a second film member provided on the contact part.