发明名称 |
Method of Electroplating and Depositing Metal |
摘要 |
A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer. |
申请公布号 |
US2014001051(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201213623480 |
申请日期 |
2012.09.20 |
申请人 |
WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG;VIKING TECH CORPORATION |
发明人 |
WEI SHIH-LONG;HSIAO SHEN-LI;HO CHIEN-HUNG |
分类号 |
C25D5/02;C25D5/10 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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