| 发明名称 |
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate. |
| 申请公布号 |
US2014001619(A1) |
申请公布日期 |
2014.01.02 |
| 申请号 |
US201313846591 |
申请日期 |
2013.03.18 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOO DO JAE;LEE YOUNG KI;SUH BUM SEOK;CHAE JOON SEOK |
| 分类号 |
H01L23/495;H01L21/50 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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