发明名称 |
Vibration isolation interposer die |
摘要 |
<p>In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.
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申请公布号 |
EP2455329(A3) |
申请公布日期 |
2014.01.01 |
申请号 |
EP20110190205 |
申请日期 |
2011.11.22 |
申请人 |
HONEYWELL INTERNATIONAL, INC. |
发明人 |
HORNING, ROBERT D.;SUPINO, RYAN |
分类号 |
H01L21/768;H01L25/065 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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