| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistance dicing tape or sheet that is hard to be melted or deformed even if it is further heated at about 200°C after it is adhered to an adherend, or of which adhesive force does not be increased significantly, and that can be easily peeled off without contaminating the adherend after the completion of adhesion. SOLUTION: The heat-resistance dicing tape or sheet is provided with an adhesive layer at least one surface of a substrate with glass transition temperature of 70°C, and the thermal weight loss ratio of the adhesive layer is not more than 2% when it is heated up to 200°C from room temperature at temperature rising speed of 2°C/min. After the heat-resistance dicing tape or sheet is stuck to a silicon mirror wafer, its adhesive force is 0.5 N/20 mm or less (peeling speed: 300 mm/min; peeling angle 180°) when it is heated at 200°C for 30 seconds and is cooled to 23°C. COPYRIGHT: (C)2008,JPO&INPIT |
