| 发明名称 |
Method for Forming Conductive Circuit |
| 摘要 |
<p>A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.</p> |
| 申请公布号 |
EP2582214(A3) |
申请公布日期 |
2014.01.01 |
| 申请号 |
EP20120188121 |
申请日期 |
2012.10.11 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
HAMADA, YOSHITAKA;YAMAKAWA, NAOKI |
| 分类号 |
H05K1/09;C09D11/00;H01B13/00;H01L23/482;H05K3/12 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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