| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of continuously conducting a taping process at relatively low temperatures, high in productivity, and prior to its peeling step, sufficiently and stably sticking on both the reverse faces of a lead frame and a sealing resin without peeling thereoff even if subjected to the thermal history owing to the QFN assemblage, and easily peelable in the peeling step with no paste left behind and its breakage, and to provide a thermosetting resin composition to be used in the adhesive sheet. SOLUTION: The thermosetting resin composition for QFN comprises (a) an acrylonitrile-butadiene copolymer, (b) an expoxy resin, (c) a compound having two or more maleimido groups and (d) a reactive siloxane compound. COPYRIGHT: (C)2008,JPO&INPIT
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