| 摘要 |
A method and an apparatus for detecting defects on a wafer are provided to completely perform a defect detection with respect to the wafer by continuously imaging a scan region including an edge region through a line scanning. A light source(1) irradiates light onto a surface of a wafer. The wafer is placed on a stage(3) having a scan region. A rotating member(4) rotates the wafer being placed on the stage. An imaging unit(2) irradiates the light onto the scan region of the stage to image the wafer by a line unit. An image processing unit(5) inspects defects of the wafer using image data being inputted from the imaging unit. A display unit(6) displays the image processed result. The image processed result is obtained by extracting a pattern of an edge region from the wafer image, measuring a width of the extracted edge region, and comparing the measured width with a reference value.
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