| 摘要 |
The present invention relates to a method for manufacturing a flexible printed circuit board using flexible ink and a flexible printed circuit board manufactured thereby. The method for manufacturing a flexible printed circuit board according to the present invention comprises the following steps of: forming a pattern on a flexible printed circuit board; preparing a cover layer for the flexible printed circuit board; pre-bonding the cover layer to the flexible printed circuit board; hot-pressing (H/P) the cover layer on the flexible printed circuit board; coating a photo solder resist (PSR) on the flexible printed circuit board; exposing the photo solder resist (PSR) coated on the flexible printed circuit board; and developing the photo solder resist (PSR) on the flexible printed circuit board, wherein the flexible printed circuit board is manufactured without preparing, pre-bonding, and hot-pressing the cover layer by coating the photo solder resist (PSR) using flexible photo solder resist (PSR) ink. According to the present invention configured as described above, the method can remove an existing cover layer process by using flexible ink when manufacturing the flexible printed circuit board, resulting in manufacturing the flexible printed circuit board only with the photo solder resist (PSR). As a result, the method can significantly enhance the quality and reliability of the product to satisfy various desires (needs) of the user, giving a good image to the user. [Reference numerals] (AA) Land gold-plating progress;(BB) Polyimide;(CC) Secure ductility and tolerance unlike an existing method to replace existing 1 and 2, and prevent existing problems such as the handwork of coverlay, the ductility of PSR, and cracks |
