APPARATUS FOR DEPOSITTING TCL FOR LED USING SPUTTERING SYSTEM

摘要

The present invention relates to a device for depositing a transparent conductive layer of an LED using a sputtering method, capable of depositing the transparent conductive layer such as an ITO thin film on an LED device in a high quality state through a sputtering process without plasma degradation to the LED device by minimizing plasma damage in a sputtering process through binding plasma with a magnetic field by arranging two sputtering guns, where magnets mounted, to face each other; and variably controlling a sputtering deposition property according to the need of a user by linearly moving and rotatably composing the two sputtering guns.