发明名称 Thermally stable diamond bonded materials and compacts
摘要 Thermally stable diamond bonded construction comprise a diamond bonded body including a thermally stable region, comprising a plurality of diamond grains bonded together by a reaction product of the diamond grains with a reactant such as Si, and a polycrystalline diamond region, comprising intercrystalline bonded diamond and a catalyst material. The body further comprises a ceramic compound formed by reaction of an Nb, Zr, Ti, or Mo getter material with a gaseous element generated during HPHT sintering of the diamond bonded body. The diamond bonded body may comprise from 0.1 to 15 percent by weight of the ceramic compound. The diamond bonded body can be formed during a single HPHT process operated at different temperatures when the reactant has a melting temperature above the catalyst material. The construction may include a metallic substrate attached to the diamond bonded body to facilitate use as a wear or cutting element.
申请公布号 US8616307(B2) 申请公布日期 2013.12.31
申请号 US20100970721 申请日期 2010.12.16
申请人 VORONIN GEORGIY;BELNAP J. DANIEL;SMITH INTERNATIONAL, INC. 发明人 VORONIN GEORGIY;BELNAP J. DANIEL
分类号 E21B10/36 主分类号 E21B10/36
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