| 发明名称 |
Illumination source and manufacturing methods |
| 摘要 |
A light source manufacturing method includes disposing LEDs upon a substrate having input pads for receiving an operating voltage for the LEDs, bonding a flexible PC board to the substrate, and using a thermally conductive adhesive bonding the substrate onto a planar region of a heat sink. |
| 申请公布号 |
US8618742(B2) |
申请公布日期 |
2013.12.31 |
| 申请号 |
US201113025849 |
申请日期 |
2011.02.11 |
| 申请人 |
SHUM FRANK TIN CHUNG;JUE CLIFFORD;SORAA, INC. |
发明人 |
SHUM FRANK TIN CHUNG;JUE CLIFFORD |
| 分类号 |
G05F1/00;F21S4/00 |
主分类号 |
G05F1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
