| 发明名称 |
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION |
| 摘要 |
<p>A thermally conductive adhesive composition containing an adhesive component and thermally conductive particles. The adhesive component contains high polymers and low polymers. The low polymer content is 1%-38% by mass relative to the total high polymer and low polymer content. The glass transition temperature of the low polymers is 20-150°C. The weight-average molecular weight of the low polymers is 6.0 × 102-5.0×104. The thermally conductive adhesive composition has a thermal conductivity of at least 0.3 W/m·K.</p> |
| 申请公布号 |
WO2013191046(A1) |
申请公布日期 |
2013.12.27 |
| 申请号 |
WO2013JP66178 |
申请日期 |
2013.06.12 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FURUTA, KENJI;TERADA, YOSHIO;INOKUCHI, SHINJI |
| 分类号 |
C09J201/00;C09J7/00;C09J11/04 |
主分类号 |
C09J201/00 |
| 代理机构 |
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