| 发明名称 |
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION |
| 摘要 |
<p>A thermally conductive adhesive composition comprising: an adhesive component containing high polymers and low polymers; and thermally conductive particles. The gel fraction measured in the adhesive component is 28%-59% by mass and the thermal conductivity thereof is at least 0.3 W/m·K.</p> |
| 申请公布号 |
WO2013191045(A1) |
申请公布日期 |
2013.12.27 |
| 申请号 |
WO2013JP66177 |
申请日期 |
2013.06.12 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
FURUTA, KENJI;TERADA, YOSHIO;INOKUCHI, SHINJI |
| 分类号 |
C09J201/00;C09J7/00;C09J11/04 |
主分类号 |
C09J201/00 |
| 代理机构 |
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