| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition excellent in all of dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesion with a copper foil, chemical resistance, flame retardancy caused by a non-halogen flame retarder; a prepreg; a metal clad laminate; and a wiring board.SOLUTION: A thermosetting resin composition includes: (A) a cyanate compound containing two or more cyanato groups in the molecule; (B) an epoxy resin containing two or more epoxy resin groups in the molecule; (C) a metal salt of 2-substituted phosphinic acid and a phosphazene compound as a flame retarder; (D) a silicone polymer containing at least one siloxane unit selected from a trifunctional siloxane unit represented by a formula: RSiO(in the formula, R represents an organic group, and R groups in the silicone polymer may mutually be the same or different) and a tetrafunctional siloxane unit represented by a formula: SiO, having a polymerization degree of 7,000 or less, and having one or more functional groups reacting with a hydroxyl group, at a terminal thereof; and (E) an inorganic filler. |
