发明名称 |
Fabrication of Window Cavity Cap Structures in Wafer Level Packaging |
摘要 |
A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate. |
申请公布号 |
US2013344638(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201213532180 |
申请日期 |
2012.06.25 |
申请人 |
DIEP BUU;BLACK STEPHEN H.;RAYTHEON COMPANY |
发明人 |
DIEP BUU;BLACK STEPHEN H. |
分类号 |
B32B38/10;H01L31/18 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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