| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which has an electronic component mounted on a copper lead frame by bonding it to the lead frame by solder, and which allows the achievement of superior bonding reliability even when used under a high temperature environment while the melting point of the solder is prevented from excessively rising.SOLUTION: The electronic device comprises: a copper lead frame 10; an electronic component 20 mounted on the lead frame 10; and a solder 30 interposed and bonding between the lead frame 10 and the electronic component 20. The lead frame 10 includes 0.09-0.40 wt.% of Ni to the total weight of the lead frame 10. The solder 30 includes 0.03-0.19 wt.% of Ni to the total weight of the solder 30. |
