发明名称 |
IMPROVED SYSTEM FOR SUBSTRATE PROCESSING |
摘要 |
A method of processing IC units comprising the steps of: dicing said IC units from a substrate; delivering said IC units to a idle block; inspecting a face of said units as exposed during the dicing step using an inspection device whilst said units are on said idle block, then; engaging said units with a picker assembly; passing said units over a second inspection device to inspect an opposed face of said units. |
申请公布号 |
US2013344629(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201214002861 |
申请日期 |
2012.03.02 |
申请人 |
BAEK SEUNG HO;JUNG JONG JAE;KIM TAE JIN;ROKKO SYSTEMS PTE LTD |
发明人 |
BAEK SEUNG HO;JUNG JONG JAE;KIM TAE JIN |
分类号 |
H01L21/67;H01L21/677 |
主分类号 |
H01L21/67 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|