| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic electronic component in which strength of a resin layer covering an external electrode is improved in solder mounting.SOLUTION: A ceramic electronic component 1 comprises: an element assembly 2; external electrodes 3, 4 totally covering the element assembly 2 on an end faces of the element assembly 2; and an insulation resin coating layer 21 which covers surfaces other than electrode sections 3d, 4d in the external electrodes 3, 4. The insulation resin coating layer 21 includes a slit 22 extending in a direction (Z direction) orthogonal to the principal plane 2c, 2d. When creeping-up of solder takes place between the insulation resin coating layer 21 and the external electrodes 3, 4 in the ceramic electronic component 1, the slit 22 of the insulation resin coating layer 21 accommodates at least one part of the solder, thereby alleviating stress by pressing force of the solder from the inner side of the insulation resin coating layer 21 to improve strength of the insulation resin coating layer 21.SELECTED DRAWING: Figure 1 |
