| 摘要 |
A bonding apparatus includes: a bonding head including a bonding tool, on which a suction surface for a chip is formed, and a heating unit; a chip supply unit; a bonding stage on which a substrate is arranged; a head movement unit configured to move the bonding head between a chip supply position by the chip supply unit and a bonding position on the bonding stage; and a cooling unit configured to cool the bonding tool. The bonding tool is configured such that the chip is supplied at the chip supply position, then is heated and bonded on the substrate at the bonding position, and is then cooled by the cooling unit. The cooling is performed by making the suction surface come in contact with a cooling surface of the cooling unit. |
