Conductive line system and process

摘要

A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each passivation layer is independently patterned. Once formed, a seed layer is deposited into the two passivation layers, and a conductive material is deposited to fill and overfill the patterns within the two passivation layers. A planarization process such as a chemical mechanical polish may then be utilized in order to remove excess conductive material and form the conductive lines within the two passivation layers.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
placing a first photosensitive material over a conductive region over a substrate; patterning the first photosensitive material to remove unexposed first photosensitive material and expose the conductive region; placing a second photosensitive material over the first photosensitive material; patterning the second photosensitive material to remove exposed second photosensitive material and expose the conductive region, the patterning the second photosensitive material forming a patterned second photosensitive material and at least one opening in the patterned second photosensitive material, wherein the first photosensitive material extends from a first sidewall of the at least one opening to a second sidewall of the at least one opening; and forming a seed layer along sidewalls of the at least one opening.