| 摘要 |
PROBLEM TO BE SOLVED: To mount components achieving high package density in a device where the components are installed on a multi-layer dielectric board.SOLUTION: An insulator layer is covered by an inner conductor, and an outer conductor is covered by the insulator layer. Openings are provided at the outer conductor and the insulator layer so as to expose the inner conductor. Signal line paths, such as a microstrip line and a coplanar line, which are formed on a surface of a dielectric board, are electrically connected with the inner conductor through the openings. This structure allows electronic components to be mounted on the dielectric board achieving higher packaging density than a convention structure. Further, the structure realizes higher heat radiation performance than the convention structure. |
