发明名称 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve reliability of a ceramic electronic component.SOLUTION: A first internal electrode 11 has a first facing part 11a and a first lead-out part 11b. The first facing part 11a faces a second internal electrode 12 via a ceramic layer 10g. The first lead-out part 11b is positioned closer to the side of a first end face 10e than the first facing part 11a. The first lead-out part 11b is connected to a first external electrode 13. The number of bridge portions 10h per unit area in the first lead-out part 11b is smaller than the number of bridge portions 10h per unit area in the first facing part 11a.
申请公布号 JP2013258229(A) 申请公布日期 2013.12.26
申请号 JP20120132724 申请日期 2012.06.12
申请人 MURATA MFG CO LTD 发明人 HIRAMATSU TAKASHI;HAMADA KUNIHIKO
分类号 H01G4/12;H01G4/232;H01G4/30 主分类号 H01G4/12
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