发明名称 |
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a ceramic electronic component.SOLUTION: A first internal electrode 11 has a first facing part 11a and a first lead-out part 11b. The first facing part 11a faces a second internal electrode 12 via a ceramic layer 10g. The first lead-out part 11b is positioned closer to the side of a first end face 10e than the first facing part 11a. The first lead-out part 11b is connected to a first external electrode 13. The number of bridge portions 10h per unit area in the first lead-out part 11b is smaller than the number of bridge portions 10h per unit area in the first facing part 11a. |
申请公布号 |
JP2013258229(A) |
申请公布日期 |
2013.12.26 |
申请号 |
JP20120132724 |
申请日期 |
2012.06.12 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HIRAMATSU TAKASHI;HAMADA KUNIHIKO |
分类号 |
H01G4/12;H01G4/232;H01G4/30 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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