发明名称 |
METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-CONNECTION |
摘要 |
A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole. |
申请公布号 |
US2013341738(A1) |
申请公布日期 |
2013.12.26 |
申请号 |
US201313921419 |
申请日期 |
2013.06.19 |
申请人 |
REINMUTH JOCHEN;FREY JENS;BERGMANN YVONNE;ROBERT BOSCH GMBH |
发明人 |
REINMUTH JOCHEN;FREY JENS;BERGMANN YVONNE |
分类号 |
B81C1/00;B81B3/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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