| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device comprises a land (external electrode pad) 10 having a lateral face (outer periphery) 10s which includes a lateral face (outer periphery) 10s1 covered with a solder resist film (insulation film) 3h and a lateral face (outer periphery) 10s2 exposed from the solder resist film. When assuming that: a virtual line which links a center 10c of the land 10 and a center of a mounting surface of a wiring board 3 is a straight line KL1; a virtual line which is orthogonal to the straight line KL1 and passes the center of the land 10 is a straight line KL2; a region on a side nearer to a peripheral border part of the mounting surface of the wiring board 3 is a region R1 when the land 10 is divided by the straight line KL2, and a region in the region R1, which forms an angle with the straight line KL1 in planar view of within a range of ±45° is a region R2, the lateral face 10s2 overlaps the straight line KL1 in planar view and is arranged so as to fall in the region R2. |
