发明名称 RESIN COMPOSITION FOR PLASTIC CARD
摘要 CONSTITUTION: A resin composition for a heat-resistant plastic card comprises 0.01 to 2.0 pts.wt. of (B) a phosphite ester-based compound and 0.01 to 2.0 pts.wt. of (C) a specific phosphite ester-based compound (C), based on 100 pts.wt. of a resin composition comprising 70 to 25 wt.% of a polycarbonate resin, 10 to 75 wt.% of a carboxylic acid-modified polybutylene terephthalate and 0 to 65 wt.% of a polybutylene terephthalate.EFFECT: According to the present invention, there is provided a resin composition for a plastic card capable of providing a plastic card having good hue which causes no discoloration or bleeding of ink, is not only dramatically improved in adhesiveness between plastic card substrates but also suppressed in the warpage property of plastic cards and significantly improved in thermal stability.SELECTED DRAWING: None
申请公布号 JP2016121276(A) 申请公布日期 2016.07.07
申请号 JP20140262206 申请日期 2014.12.25
申请人 SUMIKA STYRON POLYCARBONATE LTD 发明人 NAGANO KEISAI
分类号 C08L69/00;C08K5/524;C08L67/02 主分类号 C08L69/00
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