METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA

摘要

PROBLEM TO BE SOLVED: To provide methods and systems for inspection of wafers and reticles by using designer intent data.SOLUTION: One computer-implemented method includes identifying nuisance defects on a wafer on the basis of inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer on the basis of defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit on the basis of data generated by inspection of a wafer.SELECTED DRAWING: Figure 1