| 摘要 |
The present invention relates to a piezo-resonator package and a manufacturing method thereof and, more particularly, to a piezo-resonator package and a manufacturing method thereof including a substrate having a wire pattern, an embedded capacitor embedded in the substrate while being electrically connected to the wire pattern, and a piezo-resonator chip embedded in the substrate while being electrically connected to the wire pattern and having a feature that the embedded capacitor is a multilayer ceramic capacitor (MLCC). According to the present invention, a user can easily embed the embedded capacitor having capacitance proper for the purpose in the piezo-resonator package and the reduction of manufacturing costs and mass production can be possible as a manufacturing process of the piezo-resonator package and its speed are increased. |
