| 摘要 |
The present invention relates to a stripping system which is to remove a hardened part with a liquid chemical after exposing light during the manufacturing process of a printed circuit board (PCB). By performing a stripping process by jetting the liquid chemical to a substrate while vertically transferring a substrate inside a stripping room, the process can be conducted continuously and the time required for the stripping process can be shortened. In addition, because the stripping process is performed by jetting the liquid chemical to a substrate while vertically transferring the substrate, the vertical substrate stripping system can significantly increase a process yield ratio. According to an embodiment of the present invention, the vertical substrate stripping system comprises: the stripping room which is formed on a frame to be closed; a transferring unit which vertically transfers the substrate in the inner space of the stripping room; a jetting unit which uniformly jets the liquid chemical to the substrate that is transferred vertically in the inner space of the stripping room; and a pumping unit which collects the liquid chemical jetted to the substrate in the inner space of the stripping room and supplies the liquid chemical to the jetting unit through pumping. |
