发明名称 HIGH FREQUENCY WIRING STRUCTURE, HIGH FREQUENCY MOUNTING BOARD, METHOD FOR MANUFACTURING HIGH FREQUENCY WIRING STRUCTURE AND METHOD FOR SHAPING WAVEFORM OF HIGH FREQUENCY SIGNAL
摘要 PROBLEM TO BE SOLVED: To appropriately shape a signal waveform even when a wire length of a wiring pattern is long.SOLUTION: A high frequency wiring structure 1 includes a branch wiring pattern 6 formed by branching from a predetermined place of a main wiring pattern 2 corresponding to a transmission line on which a high frequency signal is transmitted. The branching wiring pattern 6 is formed by continuously connecting a plurality of segments having characteristic impedance and segment length individually set, respectively. Specific characteristic impedance and segment length of the branching wiring pattern 6 are determined so that a reflection wave generated at the boundary of two adjacent segments in the branching wiring pattern is superimposed on a signal on the main wiring pattern and a waveform of the high frequency signal propagating the transmission line is formed at an observation point on the transmission line.
申请公布号 JP2013255126(A) 申请公布日期 2013.12.19
申请号 JP20120130181 申请日期 2012.06.07
申请人 UNIV OF TSUKUBA 发明人 YASUNAGA MORITOSHI
分类号 H04L25/02;H05K1/02;H05K3/00 主分类号 H04L25/02
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