发明名称 METHOD OF MANUFACTURING EPITAXIAL SILICON WAFER AND EPITAXIAL SILICON WAFER MANUFACTURED BY THE METHOD
摘要 A method of manufacturing an epitaxial silicon wafer including a silicon wafer having a surface added with phosphorus and an epitaxial film provided on the surface includes adjusting an in-plane thickness distribution of the epitaxial film formed on the surface of the silicon wafer based on an in-plane resistivity distribution of the silicon wafer before an epitaxial growth treatment.
申请公布号 US2013337638(A1) 申请公布日期 2013.12.19
申请号 US201313916768 申请日期 2013.06.13
申请人 SUMCO TECHXIV CORPORATION 发明人 KAWASHIMA TADASHI;NONAKA NAOYA
分类号 H01L21/02 主分类号 H01L21/02
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