发明名称 |
METHOD OF MANUFACTURING EPITAXIAL SILICON WAFER AND EPITAXIAL SILICON WAFER MANUFACTURED BY THE METHOD |
摘要 |
A method of manufacturing an epitaxial silicon wafer including a silicon wafer having a surface added with phosphorus and an epitaxial film provided on the surface includes adjusting an in-plane thickness distribution of the epitaxial film formed on the surface of the silicon wafer based on an in-plane resistivity distribution of the silicon wafer before an epitaxial growth treatment. |
申请公布号 |
US2013337638(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201313916768 |
申请日期 |
2013.06.13 |
申请人 |
SUMCO TECHXIV CORPORATION |
发明人 |
KAWASHIMA TADASHI;NONAKA NAOYA |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|