发明名称 |
LASER PROCESSING SYSTEM AND METHOD OF USE |
摘要 |
A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film. |
申请公布号 |
US2013334739(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201213516954 |
申请日期 |
2012.06.15 |
申请人 |
MILLER DANIEL B.;KULIBERT JEFFREY L.;BUCKLEW JAMES J.;GATES THOMAS P.;PRECO, INC. |
发明人 |
MILLER DANIEL B.;KULIBERT JEFFREY L.;BUCKLEW JAMES J.;GATES THOMAS P. |
分类号 |
B29C35/08 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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