PACKAGE CARRIER BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a relatively thin package carrier board and a manufacturing method thereof.SOLUTION: A manufacturing method of a package carrier board is provided. A supporting plate is provided on which a metal layer is disposed. A patterned dry film layer is formed on the metal layer. A portion of the metal layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate with a surface treatment layer the portion of the metal layer exposed by the patterned dry film layer. The patterned dry film layer is removed so as to partially expose the metal layer. The surface treatment layer is used as an etching mask to etch the portion of the metal layer not covered by the surface treatment layer so as to form a patterned metal layer.