| 摘要 |
<p>Provided are a substrate conveyance device and a substrate conveyance method with which it is possible to carry out a stable pre-form task and bonding task without increasing the number of device components, even if a pre-form location varies. A substrate is sent at a pitch from an upstream side to a downstream side in the conveyance direction thereof, and a bonding agent is coated on an island of the substrate at an upstream pre-form location while the substrate is retained. Thereafter, in a downstream bonding location, a chip is bonded in the island whereupon the bonding agent is coated. The pre-form location is made to vary according to the location of the island upon the substrate. When changing the pre-form location, the pre-form location and the retention location of the substrate are changed in synchronization with each other, and the island upon the substrate is coated with the bonding agent at said changed pre-form location.</p> |
