| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a head chip that can manufacture a head chip that eliminates unevenness of a cut surface caused by being blocked in the ink flow path with chips generated in full cut of a laminated wafer and has a highly accurate cut surface, and to provide a method of manufacturing an inkjet head.SOLUTION: A method of manufacturing a head chip includes: a channel formation process to form a plurality of channels 13 at least to a surface from the surface of a wafer 10 including a piezoelectric element layer; a laminated substrate manufacturing process to manufacture a laminated substrate 20 that accumulates a plurality of pieces of wafer 10; a groove forming process to form a groove 21 along a direction to intersect with a channel 13 from a surface of the laminated substrate 20; and a cutting process to cut out a head chip 1 by cutting to the laminated substrate 20 in which the groove 21 is formed along an orthogonal direction to intersect the channel 13 with a given interval by using a cutting blade B while jetting the liquid, and exhausts chips generated when cutting the laminated substrate 20 to the external through the groove 21. |
