发明名称 |
PACKAGE STRUCTURE HAVING LATERAL CONNECTIONS |
摘要 |
An embodiment of a packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. Thus, well-established techniques for incorporating a lead frame or any other conductive system in a package may be applied in order to impart wireless lateral connectivity to packaged semiconductor devices in an electronic system. |
申请公布号 |
US2013334675(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201313919536 |
申请日期 |
2013.06.17 |
申请人 |
STMICROELECTRONICS S.R.I. |
发明人 |
ZIGLIOLI FEDERICO GIOVANNI;PAGANI ALBERTO |
分类号 |
H01L23/495;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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